Optical modules, as core components of optical communication systems, are essentially "signal translators" connecting the digital world. At the transmitting end, they convert electrical signals into optical signals for transmission via optical fiber, and at the receiving end, they are converted back into electrical signals, enabling seamless data interaction between devices. From speeds leaping from 1Gbps to 1.6Tbps, from discrete components to highly integrated packaging, the development of the optical module industry has consistently resonated with the digital economy. ETU-LINK Optical Communication, with its precise product strategy and outstanding technological advantages, has firmly established itself in various application scenarios.

I. Core Components and Working Logic

The functionality of an optical module depends on the coordinated efforts of optical and electrical chips; the two have distinct roles and are indispensable.

(1) Optical Chips: As the "heart," they are integrated into the TOSA (Transmitter Optical Components) and ROSA (Receiver Optical Components), containing core components such as lasers and detectors, and are responsible for electro-optical/photoelectric conversion. Currently, low-end optical chips below 10Gb/s have been domestically produced, while high-end products of 25Gb/s and above still rely on imports.

(2) Electronic Chips: As the "brain", they include driver chips, DSP chips, etc., and are responsible for tasks such as signal amplification and encoding/decoding. High-end DSP chips have long been monopolized by overseas companies such as Broadcom and Marvell.

The high-speed optical module operates in a closed loop: the transmitting electrical signal is encoded and compensated by the DSP chip, then amplified by the driver chip and used to drive the optical chip to convert it into an optical signal; the receiving optical signal is converted into a weak electrical signal by the detector, amplified, and then restored to a standard electrical signal by the DSP chip. The DSP chip eliminates transmission interference through algorithms, which is the core guarantee of signal quality at high speeds.

The core value of optical modules lies in solving the pain points of electrical signals being "limited in range and speed"—optical signals experience extremely low transmission loss and high speed in optical fibers, with bandwidth far exceeding that of cables. Without optical modules, the massive amounts of data required for training large AI models cannot be exchanged across servers. Currently, mainstream speeds cover 10Gbps to 1.6Tbps, and they are widely used in key scenarios such as data centers, telecommunications networks, and 5G base stations.

II. Five Stages of Optical Module Industry Evolution

1. The Technological Foundation Period (1960-1994)

Breakthroughs in laser technology (1960) and optical fiber communication theory (1966) laid the foundation. At this time, components were discrete, there was no standardized form, the speed was less than 1Gbps, and it was only used in a few backbone networks. Heat dissipation relied on simple casing conduction.

2. Standardization period (1995-2000)

In 1995, the first 1Gbps standardized optical module entered mass production, and the GBIC standard enabled hot-swapping functionality, making optical modules independent products. In 1999, the 1X9 package module optimized compatibility, with single-module power consumption of 1-2W, and the issue of contact thermal resistance began to emerge.

3. The period of accelerated miniaturization (2001-2010)

The widespread adoption of the internet spurred a shift towards "high speed + miniaturization." A 10Gbps module debuted in 2001, and in 2009, the SFP+ package achieved 10Gbps speeds in a 1/3-sized GBIC package. Single-module power consumption was 2-3W, and the reduction in size led to heat buildup , making heat conduction the primary heat dissipation path.

4. Period of rapid development (2011-2020)

Cloud computing is driving speeds towards 100Gbps, making QSFP packaging the mainstream (QSFP28 for 100G and QSFP56 for 200G). Single-module power consumption is 3.5-6W, and PAM4 modulation technology increases heat generation points, making a laser case temperature ≤70℃ a mandatory requirement.

5. The Era of Ultra-High-Speed Integration (2021 to Present)

The demand for AI computing power has driven speeds to leap to 400G, 800G, and 1.6T, compressing the iteration cycle to 2 years. 800G will see large-scale delivery in 2023, and 1.6T will enter its commercialization year in 2025. QSFP-DD and OSFP packaging have become mainstream, with 800G modules consuming 15-30W of power. New power-saving technologies such as silicon photonics, LPO, and CPO have emerged to meet this demand.

III. ETU-LINK Optical Communication Product Advantages and Scenario Implementation

In the global optical module market, Chinese companies occupy seven of the top 10 spots thanks to their packaging advantages. ETU-LINK Optical Communication, as a key player, builds its core competitiveness through "full-scenario coverage + high-performance empowerment".

Core Product Advantages

(1) Full-rate matrix coverage : Products cover mainstream speeds such as 10G, 25G, 40G, 100G, and 400G, forming a complete product chain from 10G BASE-T and 25G SFP28 modules adapted for enterprise networks to 100G SR/LR and 400G DR4 high-speed products serving data centers. Among them, the 40G ER/ZR and 100G LR/SR series have undergone long-term market verification, with signal transmission stability reaching 99.99% and yield rate consistently above 98%, offering significantly better cost-performance than similar overseas products.

(2) Customized technology adaptation : 1) Product performance is optimized for different scenario requirements. Industrial-grade modules support a wide operating temperature range of -40℃ to 85℃, making them suitable for outdoor telecom base stations and industrial control environments. 2) The power consumption of low-power series modules is reduced by 15%-20% compared to the industry average, which aligns with green data center policies. 3) Long-distance transmission products (such as 40G ZR and 100G ER) improve transmission distance by 30% compared to standard products through optimized optical chip coupling technology, meeting the needs of cross-regional data interconnection.

(3) High compatibility and guaranteed delivery : Products strictly adhere to IEEE and MSA standards, ensuring seamless compatibility with mainstream equipment manufacturers such as Huawei, H3C, and Cisco. Leveraging flexible production lines, customized needs can be responded to quickly, with standard product delivery cycles shortened to 7-10 days, and urgent orders shipped within 48 hours, meeting customers' needs for rapid project implementation.

Key Application Scenarios

A. Data Center Interconnect : The 100G SR/LR and 400G DR4 modules, with their low latency (≤300ns) and high bandwidth, are used for interconnecting server clusters of cloud vendors to support the data transmission needs of big data analysis and AI model training. They have already served many small and medium-sized cloud enterprises in China.

B. Telecom backbone network and 5G base stations : 40G ER/ZR and 100G ER modules are adapted to long-distance transmission requirements and have become the core choice for regional telecom operators to upgrade their backbone networks; 25G SFP28 modules are widely used in the fronthaul links of 5G base stations to ensure efficient data interaction between base stations and the core network.

C. Enterprise and Industrial Networks : 10G and 25G low-speed modules offer high stability and cost-effectiveness, covering scenarios such as enterprise campus networks and smart factory industrial internet, helping customers achieve network upgrades and digital transformation. Our business has expanded to more than 100 countries and regions worldwide.

IV. Industry Trends and Development Prospects

The optical module industry is currently undergoing a technological revolution towards high speed and low power consumption, with new technologies such as silicon photonics, LPO, and CPO gradually being implemented, leading to a rapid increase in demand for 1.6T modules. ETU-LINK Optical Communication has initiated pre-research on 1.6T modules and is also collaborating deeply with domestic optical chip manufacturers to advance the testing of domestic substitution for 25G and 50G high-end optical chips, continuously reducing reliance on imported core materials.

In the global wave of digitalization, the importance of optical modules as a "computing power transmission link" is becoming increasingly prominent. ETU-LINK Optical Communication, with its full-scenario product portfolio, customized technology advantages, and efficient delivery capabilities, has established a solid market position in enterprise networks, telecommunications operations, and data centers. Looking ahead, with the acceleration of domestic substitution and breakthroughs in ultra-high-speed module technology, the company will continue to deepen its presence in niche markets, providing global customers with higher-quality optical communication solutions and contributing to the high-quality development of the digital economy.